Irdeto and Twise expand CI Plus 2.0 ecosystem

Irdeto and Twise have announced an expansion to their CI Plus 2.0 ecosystem with a new software solution.

The new tech combines Irdeto Cloaked CA technology and Twise latest CI Plus stack tailored for MT5711 Mediatek chipsets to comply with security requirements including CI Plus ECP based on a secure chipset anchor.

The companies said that the solution enables any manufacturer to produce a USB CAM in a record time, with the first products expected in the first half of 2023.

While the older PCMCIA form factor has geographically limited the market almost completely to Europe, the shift to USB has enabled CE manufacturers with the chance to grow into India, MENA, LATAM and African regions.

Peter Oggel, CTO and SVP of Solutions at Irdeto, said: “We are excited to bring new growth opportunities to the CE manufacturers globally while also offering the more sustainable choice. Cloaked CA helps to eliminate the logistical expenses and complexity associated with smart card distribution. The local manufacturing of USB CAMs further reduces the environmental impact. We are happy to be able to bring this new solution to the market together with Twise.” 

Stéphanie Bizouerne, Twise co-founder, said: “We’ve been cooperating with Irdeto over the last years, and we are proud to achieve this new milestone jointly. The solution paves the way for a CI Plus 2.0 USB CAM deployment in a very near future.”